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Electronic Preforms

Typical solder and alloy preforms used in the electronics manufacturing industry include a variety of shapes including but not limited to square, rectangular, disc, frames and washers. These preforms are tested to ensure their excellence in providing optimum thermal and electrical conductivity for electrical connections.

Washers for Electronic Packaging ApplicationsBraze Alloy Discs for Electronic Packaging ApplicationsBraze Alloy Frames for Electronic Packaging ApplicationsBraze Alloys Squares for Electronic Packaging

COMMON PREFORM MATERIALS

GOLD SILVER PALLADIUM PLATINUM COPPER
  • Au
  • Au/Cu
  • Au/Ge
  • Au/Ni
  • Au/Sn
  • Au/Pd
  • Ag
  • Ag/Cu
  • Pd/Ag/Cu
  • Pt
  • Pt/Cu
  • Cu
  • Cu/Mn/Ni

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SOLDER SPHERES

Prince & Izant also supplies solder spheres for electronic packaging applications. Spheres are primarily composed of silver, lead and tin materials and are used in a variety of ball grid array (BGA) applications.

Electronic SpheresL BGA packaging: Prince Izant

TYPICAL MATERIALS CHARACTERISTICS SUBMIT RFQ
Sn63/Pb37
  • Exceptional tinning and wetting properties
  • Good bonding properties
  • Used in SMT and through-hole elctronics
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Sn62/Pb36/Ag2
  • Strongest tin-lead solder
  • Suitable for soldering silver-metallized surfaces
  • Used in SMD capacitors and other silver-metallized ceramics
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Pb90/Sn10
  • Lower cost
  • Good bonding properties
  • Used for CBGA components
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SOLDER SPHERE BENEFITS:

  • Clean and smooth surfaces
  • Tight size distribution
  • Flexible layouts
  • Faster Products
  • Cost effective


Current Market Prices

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