Typical solder and alloy preforms used in the electronics manufacturing industry include a variety of shapes including but not limited to square, rectangular, disc, frames and washers. These preforms are tested to ensure their excellence in providing optimum thermal and electrical conductivity for electrical connections.
COMMON PREFORM MATERIALS
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Prince & Izant also supplies solder spheres for electronic packaging applications. Spheres are primarily composed of silver, lead and tin materials and are used in a variety of ball grid array (BGA) applications.
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SOLDER SPHERE BENEFITS:
- Clean and smooth surfaces
- Tight size distribution
- Flexible layouts
- Faster Products
- Cost effective