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Electronic Paste and Powder

Prince & Izant offers a comprehensive line of tin, tin/lead, gold/tin and silver/copper/zinc based solder pastes and powders for surface mount, semiconductor and electronic printing applications.

Electronic Paste and Powder Image: Prince and Izant

COMMON ELECTRONIC PASTE AND POWDER MATERIALS

MATERIAL CHARACTERISTICS SUBMIT RFQ
Sn
  • Good wetting
  • Great void performance
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Sn/Pb
  • Good wetting in air reflow
  • Good performance and reliability
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Au/Sn
  • High melting point
  • High tensile stress
  • No creep
  • Pb-free
  • Corrosion resistant
  • Excellent thermal conductivity 
Submit RFQ
Ag/Cu/Zn
  • High strength
  • Excellent for joints that require ductility
Submit RFQ

POWDER MESH SIZING CHART

MM UM IN MILS US STD SIEVE DEISGNATION TYLER STD SIEVE
.0381 38.1 .00150 1.50 38µm (No.400) 400 mesh
.0445 44.5 .00175 1.75 45µm (No.325) 325 mesh
.0737 73.7 .00290 2.90 75µm (No.200) 200 mesh
.1101 110.7 .00436 4.36   140 mesh
.1490 149.0 .00587 5.87 150µm (No.100) 100 mesh
.1770 177.0 .00697 6.97 180µm (No.80) 80 mesh


Gold
Silver
Platinum
Palladium