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Electronic Bonding Wire and Ribbon

As electronic manufacturers strive towards the miniaturization of their products, bonding wires and ribbons have seen an increase in popularity. Both bonding wire and ribbon are manufactured from high purity materials with doping additions. These dopants, or trace impurity elements inserted into a substance in low concentrations, alter the structure of the materials thus improving overall mechanical properties.

Electronic Bonding Wire and Ribbon

METAL BONDING WIRE BONDING RIBBON CHARACTERISTICS SUBMIT RFQ
Gold x x Au Bonding Wire:
  • Corrosion resistant
  • Homogenous chemical compositions
  • Stable mechanical properties
Au Bonding Ribbon:
  • High precision dimensional characteristics
  • High precision mechanical characteristics
  • Electrical looping behaviors
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Copper x  
  •  Stable mechanical properties
  • High bonding reliability
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Aluminum x x Al Bonding Wire:
  • Homogenous chemical compositions
  • Stable mechanical properties
  • Excellent bondability
Al Bonding Ribbon:
  • Great dimensional accuracy
  • Good heat dissipation 
  • Low impedence
  • Larger surface for electrical connections
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Silver   x
  •  High precision dimensional characteristics
  • High precision mechanical characteristics
  • Electrical looping behaviors
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Platinum   x
  • High precision dimensional characteristics
  • High precision mechanical characteristics
  • Electrical looping behaviors
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COMMON APPLICATIONS

BONDING WIRE BONDING RIBBON
Ball Bonding
  • High-power components
  • High pin-count components
  • Ultra-fine pitch devices
Wedge Bonding
  • High-frequency applications
  • Optoelectronics
Stud Bumping
  • Flip-chip applications
  • Chip-to-chip applications
  • Power applications
  • High frequency devices
  • Microwave devices
Gold
Silver
Platinum
Palladium